| BODY HEIGHT | 0.008 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| BODY LENGTH | 0.400 INCHES NOMINAL |
| BODY WIDTH | 0.200 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| DESIGN FUNCTION AND QUANTITY | 3 GATE, NAND |
| FEATURES PROVIDED | MEDIUM SPEED AND LOW IMPEDANCE AND MONOLITHIC |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | TRIPLE 3 INPUT |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| OVERALL WIDTH | 0.600 INCHES MINIMUM AND 1.000 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| SPECIFICATION/STANDARD DATA | 25500-3100109-007 MANUFACTURERS SOURCE CONTROL |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 15.0 VOLTS MAXIMUM POWER SOURCE |