COMPONENT FUNCTION RELATIONSHIP | MATCHED |
COMPONENT NAME AND QUANTITY | 2 TRANSISTOR |
FEATURES PROVIDED | HERMETICALLY SEALED CASE |
INTERNAL CONFIGURATION | FIELD EFFECT ALL TRANSISTOR |
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-18 ALL TRANSISTOR |
MOUNTING METHOD | TERMINAL ALL TRANSISTOR |
OVERALL DIAMETER | 0.209 INCHES MINIMUM AND 0.230 INCHES MAXIMUM ALL TRANSISTOR |
OVERALL LENGTH | 0.170 INCHES MINIMUM AND 0.210 INCHES MAXIMUM ALL TRANSISTOR |
POWER RATING PER CHARACTERISTIC | 200.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION ALL TRANSISTOR |
SEMICONDUCTOR MATERIAL | SILICON ALL TRANSISTOR |
TERMINAL CIRCLE DIAMETER | 0.100 INCHES NOMINAL ALL TRANSISTOR |
TERMINAL LENGTH | 0.500 INCHES MINIMUM ALL TRANSISTOR |
TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD ALL TRANSISTOR |